We provides various room temperature curing adhesive solutions for different applications. Our products are based on alkoxy, acetoxy or oxime chemistry and developed to have excellent weather resistance and electrical performance. They are widely used in the fields of electronics and new energy.
CIPG
AdheSil 3150FB
We provides various room temperature curing adhesive solutions for different applications. Our products are based on alkoxy, acetoxy or oxime chemistry and developed to have excellent weather resistance and electrical performance. They are widely used in the fields of electronics and new energy.
Cover Adhesion
EncapSil 1400 L15
Fire resistency and with low density potting material
light weight with fire resistency
EncapSil 1400C86
In order to better meet the needs of waterproofing, thermal conductivity, shocking resistance, insulation, and dust prevention, LinkTech provides customers with numbers of encapsulant solutions. All products meet UL94V-0 flame retardant certification (RTI-150C, refer to UL file number E502051).
Thermal conductive potting
EncapSil 1400C85
In order to better meet the needs of waterproofing, thermal conductivity, shocking resistance, insulation, and dust prevention, LinkTech provides customers with numbers of encapsulant solutions. All products meet UL94V-0 flame retardant certification (RTI-150C, refer to UL file number E502051).
Thermal conductive potting
SE-7109
High molecular weight silicone dispersion
Silicone dispersant, with good anti-sticking and smooth properties, can obviously improve the wear and scratch resistance of dry method resin
ACRT-3550
Multifunctional high molecular weight organosilicone acrylate
UV curable coatings or inks to improve coating slip, anti-adhesion, scratch resistance, surface smoothness, flexibility and hydrophobicity
SW-278
Super wetting agent for agriculture
Low foam, low freezing point (-30 ℃), suitable for low temperature weather.
SW-277
Super wetting agent for agriculture
Medium-high foam, it is recommended to tank mixing.